934058279118
vs
BUK7609-75A,118
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
SMALL OUTLINE, R-PSSO-G2
PLASTIC, D2PAK-3
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
Additional Feature
LOGIC LEVEL COMPATIBLE
Avalanche Energy Rating (Eas)
560 mJ
560 mJ
Case Connection
DRAIN
DRAIN
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
75 V
75 V
Drain Current-Max (ID)
75 A
75 A
Drain-source On Resistance-Max
0.009 Ω
0.009 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code
R-PSSO-G2
R-PSSO-G2
Number of Elements
1
1
Number of Terminals
2
2
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Pulsed Drain Current-Max (IDM)
440 A
440 A
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
SINGLE
SINGLE
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
2
Part Package Code
D2PAK
Pin Count
3
Manufacturer Package Code
SOT404
HTS Code
8541.29.00.75
JESD-609 Code
e3
Moisture Sensitivity Level
1
Operating Temperature-Max
175 °C
Peak Reflow Temperature (Cel)
245
Power Dissipation-Max (Abs)
230 W
Qualification Status
Not Qualified
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare BUK7609-75A,118 with alternatives