934037820127
vs
BT137X-600F,127
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
WEEN SEMICONDUCTORS CO LTD
NXP SEMICONDUCTORS
Package Description
FLANGE MOUNT, R-PSFM-T3
PLASTIC, FULL PACK-3
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.30.00.80
8541.30.00.80
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
JEDEC-95 Code
TO-220AB
JESD-30 Code
R-PSFM-T3
R-PSFM-T3
Moisture Sensitivity Level
NOT APPLICABLE
Number of Elements
1
1
Number of Terminals
3
3
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RMS On-state Current-Max
8 A
8 A
Repetitive Peak Off-state Voltage
600 V
600 V
Surface Mount
NO
NO
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
SINGLE
SINGLE
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Device Type
4 QUADRANT LOGIC LEVEL TRIAC
4 QUADRANT LOGIC LEVEL TRIAC
Base Number Matches
2
2
Rohs Code
Yes
Part Package Code
TO-220
Pin Count
3
Manufacturer Package Code
SOT186A
Critical Rate of Rise of Off-State Voltage-Min
50 V/us
DC Gate Trigger Current-Max
25 mA
DC Gate Trigger Voltage-Max
1.5 V
Holding Current-Max
20 mA
JESD-609 Code
e3
Leakage Current-Max
0.5 mA
Operating Temperature-Max
125 °C
Repetitive Peak Off-state Leakage Current-Max
500 µA
Terminal Finish
TIN
Compare 934037820127 with alternatives
Compare BT137X-600F,127 with alternatives