933876920623
vs
M74HCT533B1R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
STMICROELECTRONICS
Part Package Code
SOIC
DIP
Package Description
SOP,
DIP, DIP20,.3
Pin Count
24
20
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
HCT
JESD-30 Code
R-PDSO-G24
R-PDIP-T20
JESD-609 Code
e4
e3
Length
15.4 mm
Logic IC Type
REGISTERED BUS TRANSCEIVER
BUS DRIVER
Moisture Sensitivity Level
1
Number of Bits
1
8
Number of Functions
8
1
Number of Ports
2
2
Number of Terminals
24
20
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
12.5 ns
56 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
3.93 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.5 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Load Capacitance (CL)
150 pF
Max I(ol)
0.006 A
Package Equivalence Code
DIP20,.3
Packing Method
TUBE
Prop. Delay@Nom-Sup
45 ns
Compare 933876920623 with alternatives
Compare M74HCT533B1R with alternatives