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933861300602 vs N74F112D,623 feature comparison

933861300602 NXP Semiconductors

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N74F112D,623 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 9.9 mm
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Moisture Sensitivity Level 1 1
Number of Bits 1 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 7.5 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 3.9 mm
fmax-Min 80 MHz 80 MHz
Base Number Matches 1 1
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 80000000 Hz
Max I(ol) 0.02 A
Package Equivalence Code SOP16,.25
Packing Method TR
Power Supply Current-Max (ICC) 21 mA
Logic » FF/Latches
Logic » FF/Latches

Compare 933861300602 with alternatives

Compare N74F112D,623 with alternatives