933798870652 vs L8C409CC25 feature comparison

933798870652 NXP Semiconductors

Buy Now Datasheet

L8C409CC25 LOGIC Devices Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS LOGIC DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 520 ns 20 ns
Cycle Time 71.428 ns 40 ns
JESD-30 Code R-PDIP-T28 R-GDIP-T28
JESD-609 Code e3
Length 35.5 mm 36.83 mm
Memory Density 576 bit 576 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 64 words 64 words
Number of Words Code 64 64
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64X9 64X9
Output Enable YES NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Memory IC Type OTHER FIFO
Moisture Sensitivity Level 3
Output Characteristics TOTEM POLE
Supply Current-Max 0.09 mA

Compare 933798870652 with alternatives

Compare L8C409CC25 with alternatives