933769260602
vs
MC74F51N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
MO-001AA
DIP
Package Description
DIP,
DIP,
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ASYMMETRICAL INPUTS
ASYMMETRICAL INPUTS
Family
F/FAST
F/FAST
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e4
e0
Length
19.025 mm
18.86 mm
Logic IC Type
AND-OR-INVERT GATE
AND-OR-INVERT GATE
Number of Functions
2
2
Number of Inputs
6
6
Number of Terminals
14
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
6.5 ns
4.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
4.69 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
1
3
Load Capacitance (CL)
50 pF
Power Supply Current-Max (ICC)
7.5 mA
Compare 933769260602 with alternatives
Compare MC74F51N with alternatives