933748630652
vs
GD74HCT03J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
GOLDSTAR ELECTRON CO LTD
Part Package Code
DIP
Package Description
DIP,
,
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDIP-T14
R-CDIP-T14
JESD-609 Code
e4
Length
19.025 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
36 ns
24 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Base Number Matches
1
2
Load Capacitance (CL)
50 pF
Compare 933748630652 with alternatives
Compare GD74HCT03J with alternatives