933728080118
vs
MCP23009-E/MG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
QFN
Package Description
SOP,
QFN-16
Pin Count
16
16
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
0.1 MHz
10 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G16
S-PQCC-N16
Length
10.3 mm
3 mm
Number of I/O Lines
8
8
Number of Ports
1
8
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
0.9 mm
Supply Voltage-Max
6 V
5.5 V
Supply Voltage-Min
2.5 V
1.8 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Width
7.5 mm
3 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
Pbfree Code
Factory Lead Time
11 Weeks
Samacsys Manufacturer
Microchip
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Bits
8
Package Equivalence Code
LCC16,.12SQ,20
Supply Current-Max
1 mA
Terminal Finish
MATTE TIN
Compare 933728080118 with alternatives
Compare MCP23009-E/MG with alternatives