933715050653
vs
TC74HCT174AP
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TOSHIBA CORP
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
3.90 MM, PLASTIC, MS-012AC, SOT-109-1, SO-16
|
DIP, DIP16,.3
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HCT
|
HCT
|
JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
JESD-609 Code |
e4
|
|
Length |
9.9 mm
|
19.25 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
6
|
6
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Propagation Delay (tpd) |
53 ns
|
43 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
4.45 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
3.9 mm
|
7.62 mm
|
fmax-Min |
20 MHz
|
61 MHz
|
Base Number Matches |
1
|
2
|
Load Capacitance (CL) |
|
50 pF
|
Max Frequency@Nom-Sup |
|
24000000 Hz
|
Max I(ol) |
|
0.004 A
|
Package Equivalence Code |
|
DIP16,.3
|
Packing Method |
|
TUBE
|
|
|
|
Compare 933715050653 with alternatives
Compare TC74HCT174AP with alternatives