933706680602 vs 74HC4002N,652 feature comparison

933706680602 NXP Semiconductors

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74HC4002N,652 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, SOT-27-1, DIP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST HC/UH
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4 e4
Length 19.025 mm 19.025 mm
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 2
Number of Inputs 2 4
Number of Terminals 14 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 5.3 ns 30 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 4.2 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Manufacturer Package Code SOT27-1
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method BULK
Prop. Delay@Nom-Sup 30 ns
Schmitt Trigger NO

Compare 933706680602 with alternatives

Compare 74HC4002N,652 with alternatives