933706680602 vs 5962-8951001CA feature comparison

933706680602 NXP Semiconductors

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5962-8951001CA Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, 0.300 INCH, CERAMIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e4 e0
Length 19.025 mm 19.56 mm
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 3
Number of Inputs 2 3
Number of Terminals 14 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 5.3 ns 6 ns
Qualification Status Not Qualified Qualified
Seated Height-Max 4.2 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
ECCN Code EAR99
Load Capacitance (CL) 50 pF
Max I(ol) 0.001 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Power Supply Current-Max (ICC) 12 mA
Prop. Delay@Nom-Sup 6 ns
Schmitt Trigger NO
Screening Level MIL-STD-883

Compare 933706680602 with alternatives

Compare 5962-8951001CA with alternatives