933699610135 vs BZV55C24 feature comparison

933699610135 NXP Semiconductors

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BZV55C24 North American Philips Discrete Products Div

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NORTH AMERICAN PHILIPS DISCRETE PRODUCTS DIV
Package Description O-LELF-R2
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2
Operating Temperature-Max 200 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 24 V 24 V
Surface Mount YES YES
Technology ZENER
Terminal Finish Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form WRAP AROUND
Terminal Position END
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Tol-Max 5% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 2 28
Dynamic Impedance-Max 70 Ω

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Compare BZV55C24 with alternatives