933699380135
vs
TZMC2V7GS18
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
TEMIC SEMICONDUCTORS
Package Description
HERMETIC SEALED, GLASS, SMD, 2 PIN
Pin Count
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin (Sn)
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
5%
Working Test Current
5 mA
5 mA
Base Number Matches
2
2
Additional Feature
LOW NOISE
Knee Impedance-Max
600 Ω
Operating Temperature-Max
175 °C
Reverse Current-Max
10 µA
Voltage Temp Coeff-Max
-1.62 mV/°C
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