933659350113
vs
BZV85-C3V6
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DO-41
DO-41
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-LALF-W2
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3.6 V
3.6 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Voltage Tol-Max
5%
5%
Working Test Current
60 mA
60 mA
Base Number Matches
1
6
Samacsys Manufacturer
NXP
Additional Feature
CAPACITANCE IS CAPTURED FROM THE GRAPH
Dynamic Impedance-Max
15 Ω
JESD-609 Code
e3
Moisture Sensitivity Level
1
Operating Temperature-Max
200 °C
Reference Standard
CECC50005-010
Reverse Current-Max
50 µA
Terminal Finish
Tin (Sn)
Voltage Temp Coeff-Max
-1 mV/°C
Compare 933659350113 with alternatives
Compare BZV85-C3V6 with alternatives