933507930652
vs
HEF4059BP
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
DIP
|
|
Package Description |
DIP,
|
DIP-24
|
Pin Count |
24
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Count Direction |
BIDIRECTIONAL
|
|
Family |
4000/14000/40000
|
|
JESD-30 Code |
R-PDIP-T24
|
R-PDIP-T24
|
JESD-609 Code |
e3
|
|
Length |
31.7 mm
|
|
Load/Preset Input |
YES
|
|
Logic IC Type |
DIVIDE BY N COUNTER
|
PRESCALER
|
Mode of Operation |
ASYNCHRONOUS
|
|
Number of Functions |
1
|
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Propagation Delay (tpd) |
200 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.1 mm
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Trigger Type |
POSITIVE EDGE
|
|
Width |
15.24 mm
|
|
fmax-Min |
10 MHz
|
|
Base Number Matches |
1
|
2
|
Max Frequency@Nom-Sup |
|
3500000 Hz
|
Package Equivalence Code |
|
DIP24,.6
|
|
|
|
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