933507890653 vs TC4001UBP feature comparison

933507890653 NXP Semiconductors

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TC4001UBP Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4 e0
Length 8.65 mm 19.25 mm
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 130 ns 120 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.45 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Load Capacitance (CL) 50 pF
Max I(ol) 0.00061 A
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 120 ns
Schmitt Trigger NO
Temperature Grade INDUSTRIAL

Compare 933507890653 with alternatives

Compare TC4001UBP with alternatives