933500650113
vs
1N4753ARL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
ON SEMICONDUCTOR
Part Package Code
DO-41
DO-41
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-LALF-W2
Pin Count
2
2
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
10 V
36 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
5%
5%
Working Test Current
25 mA
7 mA
Base Number Matches
2
5
Manufacturer Package Code
CASE 59-10
Additional Feature
METALLURGICALLY BONDED
Dynamic Impedance-Max
50 Ω
Operating Temperature-Max
200 °C
Compare 933500650113 with alternatives
Compare 1N4753ARL with alternatives