933348560602
vs
CA339AF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
PLASTIC, SOT-27-1, DIP-14
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
0.4 µA
Input Offset Voltage-Max
4000 µV
4000 µV
JESD-30 Code
R-PDIP-T14
R-XDIP-T14
Length
19.025 mm
Number of Functions
4
Number of Terminals
14
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Type
OPEN-COLLECTOR
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Not Qualified
Response Time-Nom
1300 ns
1300 ns
Seated Height-Max
4.2 mm
Supply Voltage Limit-Max
36 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
7.62 mm
Base Number Matches
1
2
Bias Current-Max (IIB) @25C
0.25 µA
JESD-609 Code
e0
Supply Current-Max
2 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare 933348560602 with alternatives
Compare CA339AF with alternatives