933297730602 vs LM239J feature comparison

933297730602 NXP Semiconductors

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LM239J General Electric Solid State

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS GENERAL ELECTRIC SOLID STATE
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.4 µA
Input Offset Voltage-Max 9000 µV 9000 µV
JESD-30 Code R-PDIP-T14 R-XDIP-T14
Length 19.025 mm
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Output Type OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Response Time-Nom 1300 ns 1300 ns
Seated Height-Max 4.2 mm
Supply Voltage Limit-Max 36 V 36 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade OTHER OTHER
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm
Base Number Matches 1 10
JESD-609 Code e0
Package Equivalence Code DIP14,.3
Supply Current-Max 2 mA
Terminal Finish Tin/Lead (Sn/Pb)

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