933296760652
vs
CD40175BMN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e4
e0
Length
21.6 mm
19.305 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
160 ns
300 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.7 mm
5.08 mm
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
20 MHz
2 MHz
Base Number Matches
1
3
Family
4000/14000/40000
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
2000000 Hz
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Equivalence Code
DIP16,.3
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Technology
CMOS
Temperature Grade
MILITARY
Compare 933296760652 with alternatives
Compare CD40175BMN with alternatives