933296680652
vs
HEF4044BPN
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
DIP, DIP16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e4
|
|
| Length |
21.6 mm
|
21.6 mm
|
| Logic IC Type |
R-S LATCH
|
R-S LATCH
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
245
|
| Propagation Delay (tpd) |
185 ns
|
185 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.7 mm
|
4.7 mm
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Trigger Type |
LOW LEVEL
|
LOW LEVEL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Load Capacitance (CL) |
|
50 pF
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
DIP16,.3
|
| Packing Method |
|
BULK
|
| Prop. Delay@Nom-Sup |
|
185 ns
|
| Supply Voltage-Max (Vsup) |
|
15 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare 933296680652 with alternatives
Compare HEF4044BPN with alternatives