933282760652
vs
HEC4050BDB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
DIP,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T16
R-GDIP-T16
JESD-609 Code
e4
Length
21.6 mm
Logic IC Type
BUFFER
BUFFER
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
16
16
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
110 ns
70 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.7 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Additional Feature
CMOS-TTL LEVEL TRANSLATOR
Load Capacitance (CL)
50 pF
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Temperature Grade
MILITARY
Compare 933282760652 with alternatives
Compare HEC4050BDB with alternatives