933118000143
vs
BZX79C75-AP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MICRO COMMERCIAL COMPONENTS
Part Package Code
DO-35
DO-35
Package Description
HERMETIC SEALED, GLASS, SC-40, 2 PIN
O-LALF-W2
Pin Count
2
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
75 V
75 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
10
Voltage Tol-Max
5%
6.04%
Working Test Current
2 mA
2 mA
Base Number Matches
2
1
Additional Feature
METALLURGICAL BONDED
Dynamic Impedance-Max
255 Ω
Forward Voltage-Max (VF)
0.9 V
JESD-609 Code
e3
Knee Impedance-Max
500 Ω
Moisture Sensitivity Level
1
Reverse Current-Max
0.05 µA
Reverse Test Voltage
53 V
Terminal Finish
MATTE TIN
Compare 933118000143 with alternatives
Compare BZX79C75-AP with alternatives