90USB162-16MU
vs
90USB162-16MU
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ATMEL CORP
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN, LCC32,.2SQ,20
|
5 X 5 MM, GREEN, MO-220VHHD, QFN-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Additional Feature |
ALSO OPERATES WITH 2.7 V MINIMUM SUPPLY AT 8 MHZ
|
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
AVR RISC
|
|
| Clock Frequency-Max |
16 MHz
|
8 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
| Length |
5 mm
|
5 mm
|
| Number of I/O Lines |
22
|
22
|
| Number of Terminals |
32
|
32
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
512
|
|
| ROM (words) |
16384
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Speed |
16 MHz
|
48 MHz
|
| Supply Current-Max |
18 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
1.8 V
|
| Supply Voltage-Nom |
5 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
1
|
|
|
|