8X310/BQA vs AM2914XC feature comparison

8X310/BQA Philips Semiconductors

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AM2914XC AMD

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS ADVANCED MICRO DEVICES INC
Package Description DIP, DIP40,.6 DIE,
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code R-XDIP-T40 R-XUUC-N40
JESD-609 Code e0
Number of Terminals 40 40
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 230 mA 305 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology TTL BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
uPs/uCs/Peripheral ICs Type INTERRUPT CONTROLLER INTERRUPT CONTROLLER
Base Number Matches 1 1
Part Package Code DIE
Pin Count 40
Bus Compatibility 9080A
External Data Bus Width 4
Number of External Interrupts 8
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V

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