8X04F vs 67401J feature comparison

8X04F NXP Semiconductors

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67401J AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP ADVANCED MICRO DEVICES INC
Package Description , CERAMIC, DIP-16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Number of Terminals 16 16
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 2
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 16
Access Time-Max 60 ns
Clock Frequency-Max (fCLK) 10 MHz
Cycle Time 100 ns
JESD-609 Code e0
Length 19.431 mm
Memory Density 256 bit
Memory IC Type OTHER FIFO
Memory Width 4
Number of Functions 1
Number of Words 64 words
Number of Words Code 64
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 64X4
Output Characteristics TOTEM POLE
Output Enable NO
Package Code DIP
Package Equivalence Code DIP16,.3
Parallel/Serial PARALLEL
Seated Height-Max 5.08 mm
Supply Current-Max 0.16 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Technology TTL
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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