8L30210NLGI8
vs
ICSLV810FIT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
VFQFPN
SSOP
Pin Count
32
20
Manufacturer Package Code
NLG32P1
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
30210
810
Input Conditioning
DIFFERENTIAL
STANDARD
JESD-30 Code
S-PQCC-N32
R-PDSO-G20
JESD-609 Code
e3
e0
Length
5 mm
7.2 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Max I(ol)
0.0001 A
0.012 A
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
32
20
Number of True Outputs
10
10
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
SSOP
Package Equivalence Code
LCC32,.2SQ,20
SSOP20,.3
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
240
Power Supply Current-Max (ICC)
19 mA
Prop. Delay@Nom-Sup
3 ns
3.5 ns
Propagation Delay (tpd)
5 ns
3.5 ns
Same Edge Skew-Max (tskwd)
0.055 ns
0.2 ns
Seated Height-Max
1 mm
2 mm
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
1.425 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Terminal Finish
TIN
Tin/Lead (Sn85Pb15)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
DUAL
Width
5 mm
5.3 mm
fmax-Min
10 MHz
133 MHz
Base Number Matches
2
1
Package Description
SSOP, SSOP20,.3
Qualification Status
Not Qualified
Technology
CMOS
Temperature Grade
INDUSTRIAL
Time@Peak Reflow Temperature-Max (s)
30
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