89HPES4T4ZBBCI8
vs
89HPES4T4ZBBC8
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
CABGA
|
CABGA
|
Package Description |
CABGA-144
|
CABGA-144
|
Pin Count |
144
|
144
|
Manufacturer Package Code |
BC144
|
BC144
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Bus Compatibility |
PCI; SMBUS
|
PCI; SMBUS
|
Clock Frequency-Max |
100 MHz
|
100 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
JESD-609 Code |
e0
|
e0
|
Length |
13 mm
|
13 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA144,12X12,40
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
1.5 mm
|
Supply Voltage-Max |
1.1 V
|
1.1 V
|
Supply Voltage-Min |
0.9 V
|
0.9 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
20
|
Width |
13 mm
|
13 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 89HPES4T4ZBBCI8 with alternatives
Compare 89HPES4T4ZBBC8 with alternatives