89HPES24N3BXG
vs
89HPES24N3AZABX
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
BGA, BGA420,26X26,40
|
LBGA,
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
3A991.A.2
|
HTS Code |
8542.39.00.01
|
8542.31.00.01
|
JESD-30 Code |
S-PBGA-B420
|
S-PBGA-B420
|
JESD-609 Code |
e1
|
e0
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
420
|
420
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA420,26X26,40
|
BGA420,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
420
|
Address Bus Width |
|
|
Bus Compatibility |
|
SMBUS
|
Clock Frequency-Max |
|
125 MHz
|
Data Transfer Rate-Max |
|
12000 MBps
|
External Data Bus Width |
|
|
Length |
|
27 mm
|
Seated Height-Max |
|
1.7 mm
|
Supply Voltage-Max |
|
1.1 V
|
Supply Voltage-Min |
|
0.9 V
|
Supply Voltage-Nom |
|
1 V
|
Technology |
|
CMOS
|
Width |
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
|
BUS CONTROLLER, PCI
|
|
|
|
Compare 89HPES24N3BXG with alternatives
Compare 89HPES24N3AZABX with alternatives