89H24NT6AG2ZCHLG8
vs
89H32H8G2ZCBLI
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
FCBGA
|
FCBGA
|
Pin Count |
484
|
484
|
Manufacturer Package Code |
HLG484
|
BL484
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
3A991.A.2
|
HTS Code |
8542.39.00.01
|
8542.31.00.01
|
JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
JESD-609 Code |
e1
|
e0
|
Moisture Sensitivity Level |
4
|
4
|
Number of Terminals |
484
|
484
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA484,22X22,40
|
BGA484,22X22,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
Base Number Matches |
2
|
2
|
Package Description |
|
23 X 23 MM, 1 MM PITCH, FCBGA-484
|
Additional Feature |
|
OPERATES AT 125 MHZ CLOCK FREQUENCY
|
Address Bus Width |
|
|
Bus Compatibility |
|
I2C; ISA; VGA; SMBUS
|
Clock Frequency-Max |
|
100 MHz
|
Data Transfer Rate-Max |
|
32 MBps
|
Drive Interface Standard |
|
IEEE 1149.6AC; IEEE 1149.1
|
External Data Bus Width |
|
|
Length |
|
23 mm
|
Seated Height-Max |
|
3.32 mm
|
Supply Current-Max |
|
5336 mA
|
Supply Voltage-Max |
|
1.1 V
|
Supply Voltage-Min |
|
0.9 V
|
Supply Voltage-Nom |
|
1 V
|
Width |
|
23 mm
|
|
|
|
Compare 89H24NT6AG2ZCHLG8 with alternatives
Compare 89H32H8G2ZCBLI with alternatives