88E1145-E1-BBM1C000
vs
KSZ9031MNXIC-TR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MARVELL SEMICONDUCTOR INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
PACKAGE
|
HVQCCN,
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8517.70.00.00
|
| Data Rate |
1000000 Mbps
|
1000000 Mbps
|
| Number of Functions |
1
|
1
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
UNSPECIFIED
|
SQUARE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
UNSPECIFIED
|
NO LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
4 Weeks
|
| Date Of Intro |
|
2016-07-26
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-30 Code |
|
S-XQCC-N64
|
| JESD-609 Code |
|
e3
|
| Length |
|
8 mm
|
| Number of Terminals |
|
64
|
| Number of Transceivers |
|
1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Code |
|
HVQCCN
|
| Package Equivalence Code |
|
LCC64,.32SQ,16
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Screening Level |
|
TS 16949
|
| Seated Height-Max |
|
0.9 mm
|
| Supply Voltage-Nom |
|
1.2 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
0.4 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
8 mm
|
|
|
|
Compare 88E1145-E1-BBM1C000 with alternatives
Compare KSZ9031MNXIC-TR with alternatives