8602301EX vs N74S301NB feature comparison

8602301EX Philips Semiconductors

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N74S301NB NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP NXP SEMICONDUCTORS
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 120 ns 50 ns
Memory Density 4096 bit 256 bit
Memory IC Type STANDARD SRAM CACHE SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 18 16
Number of Words 4096 words 256 words
Number of Words Code 4000 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 4KX1 256X1
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Technology CMOS TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Position DUAL DUAL
Base Number Matches 5 3
JESD-30 Code R-PDIP-T16
JESD-609 Code e0
Number of Ports 1
Output Characteristics OPEN-COLLECTOR
Output Enable NO
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Qualification Status Not Qualified
Surface Mount NO
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm

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