8601301EX
vs
HD74HC85P-E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
RENESAS ELECTRONICS CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
Logic IC Type
MAGNITUDE COMPARATOR
MAGNITUDE COMPARATOR
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
295 ns
265 ns
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
5
1
Pbfree Code
Yes
Rohs Code
Yes
Additional Feature
CASCADABLE
JESD-609 Code
e4
Length
19.2 mm
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Seated Height-Max
5.06 mm
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 8601301EX with alternatives
Compare HD74HC85P-E with alternatives