85528012C vs QD8289-1 feature comparison

85528012C Intersil Corporation

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QD8289-1 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR INTEL CORP
Package Description , DIP, DIP20,.3
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Bus Compatibility 8089; 80C88; 8088; 80C86; 8086 IAPX 186; IAPX 86; IAPX 88
Clock Frequency-Max 8 MHz 10 MHz
JESD-30 Code S-CQCC-N20 R-GDIP-T20
Number of Terminals 20 20
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 8 mA 165 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position QUAD DUAL
uPs/uCs/Peripheral ICs Type SYSTEM INTERFACE LOGIC, BUS ARBITER AND CONTINUOUS SIGNAL GENERATOR SYSTEM INTERFACE LOGIC, BUS ARBITER AND CONTINUOUS SIGNAL GENERATOR
Base Number Matches 2 1
Rohs Code No
JESD-609 Code e0
Length 24.825 mm
Package Code DIP
Package Equivalence Code DIP20,.3
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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