8550501RA
vs
M74HCT240B1N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
STMICROELECTRONICS
Package Description
CERAMIC, DIP-20
DIP, DIP20,.3
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-GDIP-T20
R-PDIP-T20
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
4
4
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
42 ns
42 ns
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
6
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
20
Control Type
ENABLE LOW
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.006 A
Package Equivalence Code
DIP20,.3
Prop. Delay@Nom-Sup
57 ns
Qualification Status
Not Qualified
Seated Height-Max
3.93 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 8550501RA with alternatives
Compare M74HCT240B1N with alternatives