853L022AMLFT
vs
853L022AGT
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
3.90 X 4.90 MM, 1.37 MM HEIGHT, ROHS COMPLIANT, TSSOP-8
|
TSSOP, TSSOP8,.19
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
853L
|
853L
|
Input Conditioning |
STANDARD
|
STANDARD
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e0
|
Length |
4.9 mm
|
3 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Inverted Outputs |
|
|
Number of Terminals |
8
|
8
|
Number of True Outputs |
2
|
2
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
TSSOP
|
Package Equivalence Code |
SOP8,.25
|
TSSOP8,.19
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
0.75 ns
|
0.75 ns
|
Propagation Delay (tpd) |
0.525 ns
|
0.525 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.01 ns
|
0.01 ns
|
Seated Height-Max |
1.75 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
3 mm
|
fmax-Min |
350 MHz
|
350 MHz
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
|
|
|
Compare 853L022AMLFT with alternatives
Compare 853L022AGT with alternatives