8525BGLF
vs
SY89876LMITR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
DFN
|
| Package Description |
TSSOP-20
|
MLF-16
|
| Pin Count |
20
|
16
|
| Manufacturer Package Code |
PGG20
|
MLF
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
8525
|
89876
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
R-PDSO-G20
|
S-XQCC-N16
|
| JESD-609 Code |
e3
|
|
| Length |
6.5 mm
|
3 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
20
|
16
|
| Number of True Outputs |
4
|
4
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP20,.25
|
LCC16,.12SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
1.9 ns
|
0.87 ns
|
| Propagation Delay (tpd) |
1.9 ns
|
0.87 ns
|
| Qualification Status |
Not Qualified
|
|
| Same Edge Skew-Max (tskwd) |
0.035 ns
|
0.015 ns
|
| Seated Height-Max |
1.2 mm
|
0.9 mm
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
3 mm
|
| fmax-Min |
266 MHz
|
2000 MHz
|
| Base Number Matches |
2
|
2
|
| Packing Method |
|
TR
|
| Power Supply Current-Max (ICC) |
|
100 mA
|
|
|
|
Compare 8525BGLF with alternatives
Compare SY89876LMITR with alternatives