8523BGILFT
vs
SY89831UMGTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MICROCHIP TECHNOLOGY INC
Package Description
TSSOP,
HVQCCN,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
8523
89831
Input Conditioning
DIFFERENTIAL MUX
DIFFERENTIAL
JESD-30 Code
R-PDSO-G20
S-PQCC-N16
JESD-609 Code
e3
e4
Length
6.5 mm
3 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level
1
2
Number of Functions
1
1
Number of Inverted Outputs
4
Number of Terminals
20
16
Number of True Outputs
4
4
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
1.6 ns
0.45 ns
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.05 ns
0.02 ns
Seated Height-Max
1.2 mm
0.95 mm
Supply Voltage-Max (Vsup)
3.465 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
3 mm
Base Number Matches
2
1
Pbfree Code
Part Package Code
DFN
Pin Count
16
Manufacturer Package Code
MLF
ECCN Code
EAR99
Package Equivalence Code
LCC16,.12SQ,20
Packing Method
TR
Power Supply Current-Max (ICC)
70 mA
Prop. Delay@Nom-Sup
0.45 ns
fmax-Min
2000 MHz
Compare 8523BGILFT with alternatives
Compare SY89831UMGTR with alternatives