8509701EA
vs
TC74HCT257AF-TP2EL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
DEFENSE LOGISTICS AGENCY
TOSHIBA CORP
Package Description
CERAMIC, DIP-16
SOP,
Reach Compliance Code
unknown
unknown
Family
ALS
HCT
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
13 ns
34 ns
Qualification Status
Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
16
HTS Code
8542.39.00.01
JESD-609 Code
e0
Length
10.3 mm
Load Capacitance (CL)
50 pF
Seated Height-Max
1.9 mm
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
5.3 mm
Compare 8509701EA with alternatives
Compare TC74HCT257AF-TP2EL with alternatives