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8509701EA vs 74HCT157PW,118 feature comparison

8509701EA Defense Logistics Agency

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74HCT157PW,118 NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer DEFENSE LOGISTICS AGENCY NXP SEMICONDUCTORS
Package Description CERAMIC, DIP-16 SOT-403-1, TSSOP-16
Reach Compliance Code unknown compliant
Family ALS HCT
JESD-30 Code R-GDIP-T16 R-PDSO-G16
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 13 ns 56 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code Yes
Part Package Code TSSOP
Pin Count 16
Manufacturer Package Code SOT403-1
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
JESD-609 Code e4
Length 5 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 41 ns
Seated Height-Max 1.1 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
Logic » Multiplexer/Demultiplexers
Logic » Multiplexer/Demultiplexers

Compare 8509701EA with alternatives

Compare 74HCT157PW,118 with alternatives