8506301YA
vs
8506301YA
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
DEFENSE LOGISTICS AGENCY
|
Part Package Code |
QFP
|
|
Package Description |
CERAMIC, QFP-68
|
CERAMIC, QFP-68
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.31.00.01
|
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
16
|
16
|
Clock Frequency-Max |
12 MHz
|
12 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-CQFP-F68
|
S-CQFP-F68
|
Length |
24.195 mm
|
24.195 mm
|
Number of I/O Lines |
39
|
39
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QFF
|
QFF
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Seated Height-Max |
2.69 mm
|
2.69 mm
|
Speed |
12 MHz
|
12 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.195 mm
|
24.195 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
Boundary Scan |
|
NO
|
Qualification Status |
|
Qualified
|
Screening Level |
|
MIL-STD-883
|
|
|
|
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