8413S12BKI-100LFT
vs
849S625BYILFT
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
VFQFPN
|
PTQFP
|
| Package Description |
HVQCCN, LCC72,.39SQ,20
|
7 X 7 MM, 1 MM HEIGHT, ROHS COMPLIANT, MS-026BBC-HD, TQFP-48
|
| Pin Count |
72
|
48
|
| Manufacturer Package Code |
NLG72P1
|
DXG48P2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XQCC-N72
|
S-PQFP-G48
|
| JESD-609 Code |
e3
|
e3
|
| Length |
10 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
72
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Clock Frequency-Max |
100 MHz
|
630 MHz
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HTFQFP
|
| Package Equivalence Code |
LCC72,.39SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Primary Clock/Crystal Frequency-Nom |
25 MHz
|
25 MHz
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Current-Max |
103 mA
|
|
| Supply Voltage-Max |
3.465 V
|
3.465 V
|
| Supply Voltage-Min |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN
|
TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, OTHER
|
CLOCK GENERATOR, OTHER
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare 8413S12BKI-100LFT with alternatives
Compare 849S625BYILFT with alternatives