8413209RX vs P4C149-25PMB feature comparison

8413209RX Pyramid Semiconductor Corporation

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P4C149-25PMB Pyramid Semiconductor Corporation

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Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, 0.0300 INCH, PLASTIC, DIP-18
Pin Count 20 18
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 10 ns
JESD-30 Code R-GDIP-T20 R-PDIP-T18
Length 25.3365 mm 22.86 mm
Memory Density 16384 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 4
Number of Functions 1 1
Number of Terminals 20 18
Number of Words 16384 words 1024 words
Number of Words Code 16000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 16KX1 1KX4
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 5.08 mm 5.334 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Pbfree Code No
Rohs Code No
Additional Feature LOW POWER STANDBY MODE
JESD-609 Code e0
Terminal Finish TIN LEAD

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