8413207SX
vs
HM465767BH-5:R
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEMIC SEMICONDUCTORS
Part Package Code
DFP
Package Description
DFP,
Pin Count
20
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-XDFP-F20
R-CQCC-N20
JESD-609 Code
e0
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
16KX1
16KX1
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
FLAT
NO LEAD
Terminal Position
DUAL
QUAD
Base Number Matches
1
2
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
NO
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