8408901EA
vs
8408901EX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP,
DIP,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
255 ns
265 ns
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
25 MHz
23 MHz
Base Number Matches
6
5
Length
19.56 mm
Moisture Sensitivity Level
NOT APPLICABLE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
7.62 mm
Compare 8408901EA with alternatives
Compare 8408901EX with alternatives