8404001CA vs 74HC30NB feature comparison

8404001CA Motorola Mobility LLC

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74HC30NB NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 1 1
Number of Inputs 8 8
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 150 ns 39 ns
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 5 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Length 19.025 mm
Load Capacitance (CL) 50 pF
Qualification Status Not Qualified
Seated Height-Max 4.2 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 2.54 mm
Width 7.62 mm

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