8403611JA
vs
8403611JX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
CDIP
DIP
Package Description
CERAMIC, DIP-24
DIP,
Pin Count
24
24
Manufacturer Package Code
CD24
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Date Of Intro
1989-01-01
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
32.004 mm
31.9405 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX8
2KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Qualified
Qualified
Screening Level
MIL-STD-883
Seated Height-Max
4.826 mm
5.715 mm
Standby Current-Max
0.02 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Additional Feature
AUTOMATIC POWER-DOWN
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