8403609JX vs 8403608JX feature comparison

8403609JX Cypress Semiconductor

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8403608JX Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 24 24
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
kg CO2e/kg 12 12
Average Weight (mg) 5781.95 5781.95
CO2e (mg) 69383.402 69383.402
Category CO2 Kg 12 12
Compliance Temperature Grade Military: -55C to +125C Military: -55C to +125C
Access Time-Max 45 ns 45 ns
Additional Feature AUTOMATIC POWER-DOWN
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Length 31.877 mm 32.004 mm
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 2KX8 2KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.715 mm 4.826 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 5 1
Candidate List Date 2017-07-07
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V6.01
Qualifications DLA
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare 8403609JX with alternatives

Compare 8403608JX with alternatives