82S123/BEX vs N82S123NB feature comparison

82S123/BEX YAGEO Corporation

Buy Now Datasheet

N82S123NB NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS SIGNETICS CORP
Part Package Code DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
JESD-30 Code R-CDIP-T16 R-PDIP-T16
Memory Density 256 bit 256 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 32 words 32 words
Number of Words Code 32 32
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 32X8 32X8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 3
Rohs Code No
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP16,.3
Supply Current-Max 0.096 mA
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

Compare 82S123/BEX with alternatives

Compare N82S123NB with alternatives