8202501YA vs 5962-8766107XA feature comparison

8202501YA LSI Corporation

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5962-8766107XA AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SEEQ TECHNOLOGY INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description , DIP, DIP28,.6
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 450 ns 300 ns
JESD-30 Code R-GDIP-T28 R-GDIP-T28
Memory Density 131072 bit 131072 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Organization 16KX8 16KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.1 mA 0.025 mA
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 4
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE
Package Code DIP
Package Equivalence Code DIP28,.6
Parallel/Serial PARALLEL
Programming Voltage 12.5 V
Screening Level MIL-STD-883
Standby Current-Max 0.0003 A
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm

Compare 8202501YA with alternatives

Compare 5962-8766107XA with alternatives